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Patch Notes by Rohan Vaidya: six links on Tech & AI every day.
TL;DR
The rapid expansion of AI infrastructure is forcing a confrontation with physical constraints, from power grid limitations to extreme heat management. The IEEE Spectrum article notes that mounting heat challenges are making near-total liquid cooling the new standard for AI racks. Meanwhile, the The Register article reports that Oracle’s planned Wisconsin AI datacenter faces potential delays in 2027 customer delivery because it is still awaiting regulatory approval for its grid connection.
Rohan Vaidya
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